Glossary

AMS: Analogue Mixed Signal
 
ASICs: Application Specific Integrated Circuits
 
ATE: Automatic Test Equipment
 
BIST: Built-In Self Test
 
BJT: Bipolar (Junction) Transistor
 
BoM: Bill of Material
 
CMOS: Complementary Metal Oxide Semiconductor
 
DfA: Design for Assembly
 
DfM: Design for Manufacturing/Manufacturability
 
DfQ: Design for Quality
 
DfT: Design for Test/Testability
 
DfY: Design for Yield
 
DRC: Design Rules Check
 
EDA: Electronic Design Automation
 
ESD: Electro-Static Discharge
 
FPGA: Field Programmable Gate Array
 
HBM: Human Body Model
 
IP: Intellectual Property
 
JEDEC: Joint Electron Devices Engineering Council
 
JTAG: Joint Test Action Group
 
MCM: Multi Chip Module
 
MCP: Multi Chip Package
 
MEMS: Mechanical Electrical Micro System
 
OTP: One Time Programmable
 
PCM: Process Control Monitoring
 
SCM: Supply Chain Management
 
SiP: System in Package
 
SoC: System on Chip
 
STA: Static Timing Analysis
 
TAM: Test Access Mechanism
 
TM: Test Mode
 
TP: Test Program
 
TTL: Transistor-Transistor Logic
 
VLSI: Very-Large-Scale Integration