Abstract

With foundries offering today's semiconductor technologies at affordable prices, ASICs - Application Specific Integrated Circuits, SoC - System on Chip and SiP - System in Package development are now attractive and genuinely feasible options to consider, adding value and functionality to electronic systems while reducing production costs.

This is especially true in Brazil where the government is investing in the development of a semiconductor industry through national programs such as design centers working with the most up-to-date electronic development tool flows.

However, is that enough to guarantee the success of a new IC product?

The idea persists that when an engineer has finished design work and model simulation delivers correct results the work is done. In reality, many other aspects remain, such as silicon prototype verification and revisions, test methodology, package selection, process tolerances and many more which have a crucial influence on qualification of the final product performance and price in volume production.

Considering these aspects, like testability and manufacturability, right from the beginning can save both, time and money.

In this seminar, experts will share their experiences, discuss some case scenarios and would also like to listen to and discuss yours.